Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Enhanced adhesion of PECVD carbon on dielectric materials by providing an adhesion interface

Enhanced adhesion of PECVD carbon on dielectric materials by providing an adhesion interface

US Patent 8415257 · Granted Apr 9, 2013

Estimated economic value: $4,395,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-step deposition of a spacer material for reducing void formation in a diel2015
Spacer for a gate electrode having tensile stress and a method of forming the sa2014
Technique for forming a dielectric interlayer above a structure including closel2014
Oxide deposition by using a double liner approach for reducing pattern density d2014
Compressive stress transfer in an interlayer dielectric of a semiconductor devic2014
Increased density of low-K dielectric materials in semiconductor devices by appl2014
Increased stability of a complex material stack in a semiconductor device by pro2013
Non-insulating stressed material layers in a contact level of semiconductor devi2013
Stress engineering in a contact level of semiconductor devices by stressed condu2012
Stress engineering in a contact level of semiconductor devices by stressed condu2012
Method of forming a dielectric cap layer for a copper metallization by using a h2012
Method of improving the wafer-to-wafer thickness uniformity of silicon nitride l2011