Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package system with heatspreader

Integrated circuit package system with heatspreader

US Patent 8395254 · Granted Mar 12, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming an optical semiconductor package with2025
Reliable semiconductor packages2025
Reliable semiconductor packages2025
Reliable semiconductor packages2024
Integrated circuit packaging system with interposer structure and method of manu2017
Integrated circuit packaging system with interposer structure and method of manu2016
Integrated circuit packaging system with coreless substrate and method of manufa2016
Integrated circuit packaging system with coreless substrate and method of manufa2016
Integrated circuit packaging system with planarity control and method of manufac2016
Chip scale module package in BGA semiconductor package2016
Chip scale module package in BGA semiconductor package2016
Chip scale module package in BGA semiconductor package2016