Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laser release process for very thin Si-carrier build

Laser release process for very thin Si-carrier build

US Patent 8187923 · Granted May 29, 2012

Estimated economic value: $10,419,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D textured composite silicon anode and fluorinated lithium compound electrochem2024
Assembly of a chip to a substrate2023
Direct bonded heterogeneous integration silicon bridge2023
Method of forming thin die stack assemblies2023
Transferrable pillar structure for fanout package or interconnect bridge2023
Encapsulating in-situ energy storage device with electrode contact2022
Handler bonding and debonding for semiconductor dies2022
Simplified hermetic packaging of a micro-battery2022
Simplified hermetic packaging of a micro-battery2022
Dynamic virtual audience generation2022
Microbattery with through-silicon via electrodes2022
Modular, frequency-flexible, superconducting quantum processor architecture2022