Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer grounding method for electrostatic clamps

Wafer grounding method for electrostatic clamps

US Patent 7952851 · Granted May 31, 2011

Estimated economic value: $3,468,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fiber noise cancellation2025
Tension mechanism for belt-type triboelectric separator devices2024
Vapor compression refrigeration chuck for ion implanters2017
Vapor compression refrigeration chuck for ion implanters2017
Multi-resistivity Johnsen-Rahbek electrostatic clamp2016
Multi-resistivity Johnsen-Rahbek electrostatic clamp2016
Matched coefficient of thermal expansion for an electrostatic chuck2015
Matched coefficient of thermal expansion for an electrostatic chuck2015
Gas bearing electrostatic chuck2015
Gas bearing electrostatic chuck2015
Gas bearing electrostatic chuck2015
Sample carrier and/or sample carrier processing apparatus2015