Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species

Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species

US Patent 7598153 · Granted Oct 6, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Layer transfer of films utilizing controlled shear region2022
Light emitting diode (LED) mass-transfer apparatus and method of manufacture2022
Light emitting diode (LED) test apparatus and method of manufacture2021
Light emitting diode (LED) test apparatus and method of manufacture2021
Light emitting diode (LED) mass-transfer apparatus and method of manufacture2021
Light emitting diode (LED) test apparatus and method of manufacture2021
Shaped silicon ingot using layer transfer2020
Light emitting diode (LED) test apparatus and method of manufacture2020
Seed wafer for GaN thickening using gas- or liquid-phase epitaxy2019
Bond and release layer transfer process2018
Bond and release layer transfer process2018
Method and device for slicing a shaped silicon ingot using layer transfer2018