Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hydroxyl bond removal and film densification method for oxide films using microwave post treatment

Hydroxyl bond removal and film densification method for oxide films using microwave post treatment

US Patent 7589028 · Granted Sep 15, 2009

Estimated economic value: $8,248,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Short wavelength visible light-emitting toothbrush with an electronic signal int2022
Light emitting flat flash light with a folded light path optic2019
Multilayer passivation or etch stop TFT2018
Transmission line RF applicator for plasma chamber2017
Stress control on thin silicon substrates2017
Method and apparatus for controlled dopant incorporation and activation in a che2017
Multilayer passivation or etch stop TFT2017
Short wavelength visible light-emitting toothbrush with an electronic signal int2016
Method to grow in-situ crystalline IGZO using co-sputtering targets2016
Methods for depositing a silicon containing layer with argon gas dilution2016
Pin hole evaluation method of dielectric films for metal oxide semiconductor TFT2016
Techniques for forming 3D structures2016