Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use

High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use

US Patent 7554347 · Granted Jun 30, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Manufacturing woven textile products2025
Polycyloolefinic polymers and anion exchange membranes derived therefrom2024
Transient adhesives, methods of making, and methods of use2024
Anion-exchange membranes and methods of making and using the same2024
Methods of forming stacked integrated circuits using selective thermal atomic la2024
Woven seamless pants2024
Systems and methods for creating topographical woven fabric2024
Polycyloolefinic polymers and anion exchange membranes derived therefrom2024
Transient adhesives, methods of making, and methods of use2021
Self-immolative polymers, articles thereof, and methods of making and using same2020
Mechanically flexible interconnects, methods of making the same, and methods of 2020
Reflow-compatible optical I/O assembly adapter2020