Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method

Assignee

• Teledyne Scientific & Imaging

Inventors

• Robert L. Borwick, III (26 patents)
• Philip A. Stupar (31 patents)
• Jeffrey F. DeNatale (50 patents)
• Chailun Tsai (1 patents)
• Zhimin Jamie Yao (17 patents)
• Kathleen Garrett (1 patents)
• John T. White (11 patents)
• Les Warren (2 patents)
• Morgan Tench (1 patents)

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