Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a plated microvia interconnect

Method for forming a plated microvia interconnect

US Patent 7328506 · Granted Feb 12, 2008

Estimated economic value: $10,496,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of making a circuitized substrate2017
Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Coreless layer buildup structure with LGA and joining layer2016
Method for controlling molding compound geometry around a semiconductor die2014
Exposed die overmolded flip chip package and fabrication method2014
Conducting paste for device level interconnects2014
Solder and electrically conductive adhesive based interconnection for CZT crysta2013
Solder and electrically conductive adhesive based interconnection for CZT crysta2013
Electronic package with thermal interposer and method of making same2013
Exposed die overmolded flip chip package and fabrication method2013
Coreless layer buildup structure2013
Coreless layer buildup structure with LGA2013