Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process to reduce substrate effects by forming channels under inductor devices and around analog blocks

Process to reduce substrate effects by forming channels under inductor devices and around analog blocks

US Patent 7250669 · Granted Jul 31, 2007

Estimated economic value: $325,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bonded semiconductor structure and method for forming the same2025
Probes, probe blades, tools for probe blades, blade holders, and probe systems f2025
Method for fabricating inductor module2025
Semiconductor device and manufacturing method thereof2025
Method of forming protective layer utilized in silicon remove process2025
Integrated circuit device2025
Method of fabricating an air gap2025
Multi-finger transistor structure and method of manufacturing the same2025
Semiconductor structure with heat dissipation structure and method of fabricatin2024
Integrated circuit device and fabrication method thereof2024
Method for fabricating an integrated circuit device2024
Semiconductor structure and method of wafer bonding2024