Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor structure with heat dissipation structure and method of fabricating the same

Semiconductor structure with heat dissipation structure and method of fabricating the same

US Patent 12131976 · Granted Oct 29, 2024

Estimated economic value: $558,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bonded semiconductor structure and method for forming the same2025
Semiconductor device2025
Semiconductor device2025
Method for fabricating inductor module2025
Semiconductor device and manufacturing method thereof2025
Method of forming protective layer utilized in silicon remove process2025
Integrated circuit device2025
Integrated circuit device2025
Integrated circuit device2025
Method of fabricating an air gap2025
Multi-finger transistor structure and method of manufacturing the same2025
Integrated circuit device and fabrication method thereof2024