Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Plasma detemplating and silanol capping of porous dielectric films

Plasma detemplating and silanol capping of porous dielectric films

US Patent 7176144 · Granted Feb 13, 2007

Estimated economic value: $9,412,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integration of dry development and etch processes for EUV patterning in a single2025
Data receiving apparatus and method having blind deconvolution mechanism2025
Tungsten feature fill with nucleation inhibition2025
Deposition of films using molybdenum precursors2025
Systems and methods for homogenous intermixing of precursors in alloy atomic lay2025
Systems and methods for homogenous intermixing of precursors in alloy atomic lay2025
Molybdenum deposition2025
Molybdenum fill2025
Recommendation with neighbor-aware hyperbolic embedding2025
Line bending control for memory applications2025
Metal deposition2025
Deposition of tungsten on molybdenum templates2024