Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of depositing a metal seed layer on semiconductor substrates

Method of depositing a metal seed layer on semiconductor substrates

US Patent 7074714 · Granted Jul 11, 2006

Estimated economic value: $12,872,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Oil-water separation device2025
Magnetic thin film laminated structure and micro-inductive device thereof2025
Method and system for dynamic stability control of power systems with renewable 2025
Dynamic database object description adjustment2025
Database log performance2025
Query resource optimizer2025
Source code repository debug chaining2025
Cognitive recognition and reproduction of structure graphs2025
Database query management using a new column type2024
Building and using a sparse time series database (TSDB)2024
Submodule hybrid MMC with low full-bridge ratio and DC fault processing method t2024
Access path for database optimizer2024