Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures

Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures

US Patent 7008872 · Granted Mar 7, 2006

Estimated economic value: $16,275,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plug and trench architectures for integrated circuits and methods of manufacture2025
Methods of transferring micro light emitting diode devices using electromagnetic2025
Metal space centered standard cell architecture to enable higher cell density2023
Replacement metal COB integration process for embedded DRAM2023
Via contact patterning method to increase edge placement error margin2023
Conductive cap-based approaches for conductive via fabrication and structures re2022
Apparatus for transferring plurality of micro devices and methods of fabrication2022
Ferroelectric-capacitor integration using novel multi-metal-level interconnect w2022
Via contact patterning method to increase edge placement error margin2021
Designs and methods for conductive bumps2021
Plug and trench architectures for integrated circuits and methods of manufacture2021
Conductive via and metal line end fabrication and structures resulting therefrom2021