{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Apparatus for reducing compressed dry air usage during chemical mechanical planarization", "item": "https://www.patentleaderboard.com/patent/6976906"}]}
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Home › Apparatus for reducing compressed dry air usage during chemical mechanical planarization

Apparatus for reducing compressed dry air usage during chemical mechanical planarization

US Patent 6976906 · Granted Dec 20, 2005

Estimated economic value: $9,374,000 ⓘ

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