Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching

Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching

US Patent 6903447 · Granted Jun 7, 2005

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Layout techniques and optimization for power transistors2025
Circuit and method of shutdown for bias network in high voltage amplifier2025
Parasitic capacitance reduction in GaN-on-silicon devices2025
Extrinsic field termination structures for improving reliability of high-voltage2025
Atomic layer deposition of barrier metal layer for electrode of gallium nitride 2024
High voltage stacked transistor amplifier2024
Gate metal formation on gallium nitride or aluminum gallium nitride2024
Extrinsic field termination structures for improving reliability of high-voltage2024
Reduced interfacial area III-nitride material semiconductor structures2024
Parasitic capacitance reduction in GaN devices2024
Layout techniques and optimization for power transistors2024
Heterolithic integrated circuits including integrated devices formed on semicond2023