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Home › Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist

Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist

US Patent 6881665 · Granted Apr 19, 2005

Estimated economic value: $11,122,000 ⓘ

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