Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device

Semiconductor device

US Patent 6867502 · Granted Mar 15, 2005

Estimated economic value: $121,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked die package including a first die coupled to a substrate through direct 2023
Stacked die package including a first die coupled to a substrate through direct 2021
Apparatuses comprising semiconductor dies in face-to-face arrangements2020
Apparatuses comprising semiconductor dies in face-to-face arrangements2019
Apparatuses comprising semiconductor dies in face-to-face arrangements2018
Semiconductor package with bonding wires of reduced loop inductance2017
Semiconductor device2017
Semiconductor device2016
Device having electrodes formed from bumps with different diameters2015
Semiconductor device stack with bonding layer and wire retaining member2015
Semiconductor device2015
Semiconductor device2014