Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatuses comprising semiconductor dies in face-to-face arrangements

Apparatuses comprising semiconductor dies in face-to-face arrangements

US Patent 10600762 · Granted Mar 24, 2020

Estimated economic value: $12,287,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Authentication system2025
Optical fiber connector2025
Optical fiber connector2025
Ferrule and optical connector2025
Optical connector jig, optical connector connection method, and optical connecto2025
Optical apparatus, light emitting apparatus, optical cable, and method of connec2025
Optical fiber connector2024
Optical fiber connector2024
Stacked die package including a first die coupled to a substrate through direct 2023
Stacked die package including a first die coupled to a substrate through direct 2023
Metal-clad laminate and printed wiring board2023
Fusion splicer and method for fusion-splicing optical fibers2022