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Home › Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices

Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices

US Patent 11705432 · Granted Jul 18, 2023

Estimated economic value: $8,312,000 ⓘ

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