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Home › Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses

Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses

US Patent 11081468 · Granted Aug 3, 2021

Estimated economic value: $20,873,000 ⓘ

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