Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hydrolytically stable grooved polishing pads for chemical mechanical planarization

Hydrolytically stable grooved polishing pads for chemical mechanical planarization

US Patent 6749485 · Granted Jun 15, 2004

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process of forming an electronic device including a component structure adjacent2025
Chemical mechanical polishing pad with fluorinated polymer and multimodal groove2025
Method for forming transistor devices having source region segments and body reg2025
Methods and structures for contacting shield conductor in a semiconductor device2025
Integrated transistor and resistor-diode-capacitor snubber2024
Methods and structures for contacting shield conductor in a semiconductor device2024
Transistor device having a source region segments and body region segments2024
Heterogeneous fluoropolymer mixture polishing pad2024
Semiconductor device and structure therefor2023
Low-debris fluopolymer composite CMP polishing pad2023
Transistor device having a source region segments and body region segments2023
Compressible non-reticulated polyurea polishing pad2023