Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

US Patent 6621170 · Granted Sep 16, 2003

Estimated economic value: $216,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Information processing system, information processing method, and computer progr2025
Information processing system, information processing method and non-transitory 2024
Method for manufacturing semiconductor device2024
Control method for fuel cell system2024
Information processing system, information processing method, and computer progr2023
Straddle type electric vehicle2023
Evaluation apparatus for semiconductor device2023
Moving body, steering system, control method, and program2023
Resin member and sheet using same, and heat storage material and heat control sh2022
Semiconductor device and method of manufacturing the same2022
Plurality of heat sinks for a semiconductor package2022
Straddle type electric vehicle2022