Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for sensing a wafer in a carrier

Method and apparatus for sensing a wafer in a carrier

US Patent 6568991 · Granted May 27, 2003

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carrier head for workpiece planarization/polishing2008
Carrier head for workpiece planarization/polishing2008
CMP apparatus and method2007
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Platen and manifold for polishing workpieces2006
Platen and manifold for polishing workpieces2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Method for controlling a chemical mechanical polishing (CMP) operation2005