Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for controlling a chemical mechanical polishing (CMP) operation

Method for controlling a chemical mechanical polishing (CMP) operation

US Patent 6932671 · Granted Aug 23, 2005

Estimated economic value: $13,602,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for electrochemical planarization of a workpiece2012
Carrier head for workpiece planarization/polishing2008
Carrier head for workpiece planarization/polishing2008
Method of calibration and data evaluation for eddy current metrology systems2007
Methods using eddy current for calibrating a CMP tool2007
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Platen and manifold for polishing workpieces2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006
Work piece carrier with adjustable pressure zones and barriers and a method of p2006