Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Tented plated through-holes and method for fabrication thereof

Tented plated through-holes and method for fabrication thereof

US Patent 6562654 · Granted May 13, 2003

Estimated economic value: $15,835,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Shielded package assemblies with integrated capacitor2021
Interconnected integrated circuit (IC) chip structure and packaging and method o2020
Reduced-warpage laminate structure2020
Method and system establishing a network connection2020
Bond pads with surrounding fill lines2020
Shielded package assemblies with integrated capacitor2020
Split ball grid array pad for multi-chip modules2019
Floating swimming pool cover2019
Shielded package assemblies with integrated capacitor2018
Split ball grid array pad for multi-chip modules2017
Lateral collection photovoltaics2017
Reduced-warpage laminate structure2017