Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bond pads with surrounding fill lines

Bond pads with surrounding fill lines

US Patent 10566300 · Granted Feb 18, 2020

Estimated economic value: $50,792,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus including integrated pads and methods of manufacturing the same2025
Apparatus including integrated pads and methods of manufacturing the same2023
Semiconductor interconnect structures with narrowed portions, and associated sys2023
Shielded package assemblies with integrated capacitor2021
Interconnected integrated circuit (IC) chip structure and packaging and method o2020
Reduced-warpage laminate structure2020
Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and 2020
Shielded package assemblies with integrated capacitor2020
Split ball grid array pad for multi-chip modules2019
Floating swimming pool cover2019
Shielded package assemblies with integrated capacitor2018
Split ball grid array pad for multi-chip modules2017