Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process

Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process

US Patent 6361414 · Granted Mar 26, 2002

Estimated economic value: $17,840,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for processing wafer-shaped articles2020
Prevention of particle adders when contacting a liquid meniscus over a substrate2015
Method and apparatus for cleaning a substrate using non-newtonian fluids2014
Reduction of entrance and exit marks left by a substrate-processing meniscus2014
Apparatus for cleaning contaminants from substrate2013
Carrier for reducing entrance and/or exit marks left by a substrate-processing m2013
Method and apparatus for cleaning semiconductor wafers using compressed and/or p2013
Reduction of entrance and exit marks left by a substrate-processing meniscus2012
Method for processing a substrate using a single phase proximity head having a c2012
Methods for correlating gap value to meniscus stability in processing of a wafer2012
Two-phase substrate cleaning material2012
Carrier for reducing entrance and/or exit marks left by a substrate-processing m2012