Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metallic interlocking structure

Metallic interlocking structure

US Patent 6348737 · Granted Feb 19, 2002

Estimated economic value: $18,993,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device comprising electrically stable copper filled electrically cond2012
Method of making circuitized substrates having film resistors as part thereof2012
Power core for use in circuitized substrate and method of making same2012
Method of making multilayered circuitized substrate assembly2010
Electrically stable copper filled electrically conductive adhesive2010
Method of making a circuitized substrate with enhanced circuitry and electrical 2009
Circuitized substrate with sintered paste connections, multilayered substrate as2008
Method of making mutilayered circuitized substrate assembly having sintered past2008
Structure and method for improved adhesion between two polymer films2007
Method of treating conductive layer for use in a circuitized substrate and metho2007
Method of making circuitized substrate2007
Method of making circuitized substrate2006