Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Combined CMP and plasma etching wafer flattening system

Combined CMP and plasma etching wafer flattening system

US Patent 6254718 · Granted Jul 3, 2001

Estimated economic value: $2,342,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for exhaust gas abatement under reduced pressure and apparatus therefor2022
Apparatus for exhaust gas abatement under reduced pressure2020
Chip using method and test chip2011
Chip using method and test chip2010
Cultured cell construct which contains spheroids of cultured animal cells and th2010
Blood analysis apparatus and blood analysis method2010
Blood analysis device and blood analysis method2009
Cultured cell construct containing spheroids of cultured animal cells and utiliz2008
Local dry etching method2006
Wafer table for local dry etching apparatus2006
Wafer table for local dry etching apparatus2006
Local dry etching method2005