Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a semiconductor device

Method for forming a semiconductor device

US Patent 6218302 · Granted Apr 17, 2001

Estimated economic value: $33,147,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Message encoding and transmission across multiple platforms2025
Message encoding and transmission across multiple platforms2024
Rounded metal trace corner for stress reduction2023
Message encoding and transmission across multiple platforms2023
Minimally invasive surgical apparatus and methods2022
High density interconnect structures configured for manufacturing and performanc2022
Rounded metal trace corner for stress reduction2022
Message encoding and transmission across multiple platforms2021
High density interconnect structures configured for manufacturing and performanc2020
High density interconnect structures configured for manufacturing and performanc2020
Rounded metal trace corner for stress reduction2020
Message encoding and transmission across multiple platforms2020