Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for depositing low K dielectric materials

Apparatus and method for depositing low K dielectric materials

US Patent 6176198 · Granted Jan 23, 2001

Estimated economic value: $87,341,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method to provide conditioning to a deposited powder2025
Printing method for additive manufacturing, including in-situ powder regeneratio2025
Leak detection for gas sticks2024
Substrate support providing gap height and planarization adjustment in plasma pr2019
Method and apparatus for wafer electroless plating2016
Controlled ambient system for interface engineering2015
Showerhead electrode assembly with gas flow modification for extended electrode 2015
Substrate support providing gap height and planarization adjustment in plasma pr2014
Fluid handling system for wafer electroless plating and associated methods2014
Upper electrode backing member with particle reducing features2014
Showerhead electrode assembly with gas flow modification for extended electrode 2014
Method for reduction of voltage potential spike during dechucking2014