Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls

Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls

US Patent 6127277 · Granted Oct 3, 2000

Estimated economic value: $1,477,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Notch stop pulsing process for plasma processing system2011
Methods and apparatus for sequentially alternating among plasma processes in ord2008
Reactor with heated and textured electrodes and surfaces2008
Methods for minimizing mask undercuts and notches for plasma processing system2008
Plasma etch reactor and method2007
Plasma etch reactor and method2007
Method for using a hard mask for critical dimension growth containment2005
Method for using a hard mask for critical dimension growth containment2005
Method for using a hard mask for critical dimension growth containment2005
Method for using a hard mask for critical dimension growth containment2005
Plasma etch reactor and method2005
Plasma etch reactor and method2005