Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate

Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate

US Patent 7459100 · Granted Dec 2, 2008

Estimated economic value: $23,516,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate processing system including coil with RF powered faraday shield2024
Edge ring assembly for improving feature profile tilting at extreme edge of wafe2020
Measurement apparatus and method2018
Method and device for determining information relating to the mass of a semicond2018
Semiconductor wafer processing methods and apparatus2017
Measurement apparatus and method2016
Method of controlling semiconductor device fabrication2013
Method of controlling semiconductor device fabrication2013
Minimization of mask undercut on deep silicon etch2012
Measuring apparatus2012
Measuring apparatus2012
Notch stop pulsing process for plasma processing system2011