Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Vertical device formed adjacent to a wordline sidewall and method for semiconductor chips

Vertical device formed adjacent to a wordline sidewall and method for semiconductor chips

US Patent 6091094 · Granted Jul 18, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including bonding pad metal layer structure2024
Semiconductor device including bonding pad metal layer structure2023
Method of manufacturing a superjunction semiconductor device2022
Method of reducing erosion of a nitride gate cap layer during reactive ion etch 2005
Vertical device formed adjacent to a wordline sidewall and method for semiconduc2004
Semiconductor contact and method of forming the same2002
Disposable spacer technology for device tailoring2002
Locally folded split level bitline wiring2001
Manufacturing of cavity fuses on gate conductor level2001
Method of forming wires on an integrated circuit chip2001
Embedded vertical DRAM cells and dual workfunction logic gates2001
Process of manufacturing a vertical dynamic random access memory device2001