Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having an insulating layer and method for making

Semiconductor device having an insulating layer and method for making

US Patent 5886400 · Granted Mar 23, 1999

Estimated economic value: $12,098,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of forming leadless semiconductor packages with plated leadframes and we2021
Semiconductor packages2021
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Damaging components with defective electrical couplings2020
Semiconductor packages with leadframes and related methods2019
Wafer level flat no-lead semiconductor packages and methods of manufacture2019
Methods of forming leadless semiconductor packages with plated leadframes and we2018
Damaging components with defective electrical couplings2018
Semiconductor packages and related methods2018
Wafer level flat no-lead semiconductor packages and methods of manufacture2018