Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of despositing an aluminum-rich layer

Method of despositing an aluminum-rich layer

US Patent 5807760 · Granted Sep 15, 1998

Estimated economic value: $28,902,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dynamic vacuum seal system for physical vapor deposition sputter applications2025
Optimized textured surfaces and methods of optimizing2020
Integration of shallow trench isolation and through-substrate vias into integrat2017
Stacked interconnect heat sink2015
Method of fabrication of through-substrate vias2015
Preventing electronic device counterfeits2014
Integration of shallow trench isolation and through-substrate vias into integrat2014
Modulated deposition process for stress control in thick TiN films2013
Modulated deposition process for stress control in thick TiN films2013
Solder bump structure for flip chip semiconductor devices and method of manufact2013
Solder bump structure for flip chip semiconductor devices and method of manufact2013
Stacked interconnect heat sink2013