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Home › Method of fabricating self-aligned contacts and local interconnects in CMOS and BICMOS processes using chemical mechanical polishing (CMP)

Method of fabricating self-aligned contacts and local interconnects in CMOS and BICMOS processes using chemical mechanical polishing (CMP)

US Patent 5759882 · Granted Jun 2, 1998

Estimated economic value: $7,648,000 ⓘ

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