Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pattern forming method with selective silylation utilizing lithographic double-coated patterning plate with undercoat levelling layer

Pattern forming method with selective silylation utilizing lithographic double-coated patterning plate with undercoat levelling layer

US Patent 5599653 · Granted Feb 4, 1997

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sulfonium salt, photoacid generator, curable composition, and resist composition2025
Electrical control unit with sealant between a cover, a base, and an electrical 2025
Coffee bean grinding machine2025
Coffee bean grinding machine2025
Substrate for transferring microstructures and method for manufacturing the same2025
Electronic device for resisting high-pressure liquid with breathable filter2025
Manufacturing of imprint mold-forming substrate2024
Cutter blade for coffee grinders2024
Apparatus for reduction of power-dependent optical loss in silicon photonic devi2024
Information processing apparatus and non-transitory computer readable medium tha2024
Structure for individual authentication, method for producing thereof, and indiv2024
Rectangular substrate for imprint lithography and making method2024