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Home › In-situ device removal for multi-chip modules

In-situ device removal for multi-chip modules

US Patent 5553766 · Granted Sep 10, 1996

Estimated economic value: $12,851,000 ⓘ

Assignee

IBM

Inventors

Raymond A. Jackson (30 patents)
Kathleen A. Lidestri (7 patents)
David C. Linnell (23 patents)
Raj N. Master (52 patents)

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