Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties

Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties

US Patent 5429292 · Granted Jul 4, 1995

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensing decal2023
Force detecting sensor2022
Sensing decal2022
Microelectronic package comprising tin copper solder bump interconnections and m2002
Microelectronic assembly with connection to a buried electrical element, and met2001
Low-profile microelectronic package2001
Microelectronic package including a polymer encapsulated die2000
Microelectronic assembly with connection to a buried electrical element, and met1999
Microelectronic package including a polymer encapsulated die, and method for for1999
Microelectronic assembly for connection to an embedded electrical element, and m1999
Method for forming a microelectronic assembly1998
Method for forming a microelectronic assembly1998