Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic assembly with connection to a buried electrical element, and method for forming same

Microelectronic assembly with connection to a buried electrical element, and method for forming same

US Patent 6200829 · Granted Mar 13, 2001

Estimated economic value: $33,291,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Card assembly having a loop antenna formed of a bare conductor and method for ma2000
Portable data carrier2000
Microelectronic assembly including an antenna element embedded within a polymeri2000
Microelectronic assembly with connection to a buried electrical element, and met1999
Microelectronic assembly with connection to a buried electrical element, and met1999
Microelectronic assembly with connection to a buried electrical element, and met1999
Microelectronic assembly including polymeric reinforcement on an integrated circ1999
Microelectronic assembly for connection to an embedded electrical element, and m1999
Microelectronic assembly for connection to an embedded electrical element, and m1999
Microelectronic assembly for connection to an embedded electrical element, and m1999
Method for forming a microelectronic assembly1998
Method for forming solder bumps on bond pads1998