Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of direct transferring of electrically conductive elements into a substrate

Method of direct transferring of electrically conductive elements into a substrate

US Patent 5305523 · Granted Apr 26, 1994

Estimated economic value: $7,965,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Theater rigging system2010
Theater rigging system2009
Continuous winder1998
Method of constructing an integrated circuit memory1998
Method for repairing defective electrical connections on multi-layer thin film (1998
Method for repairing defective electrical connections on multi-layer thin film (1998
High density memory structure1996
Multilayer microelectronic wiring module and method for forming the same1996
Multilayer microelectronic wiring module and method for forming the same1996
Multilayer microelectronic wiring module and method for forming the same1996
High density electronic connector and method of assembly1995
High density electronic connector and method of assembly1995