Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Direct thermocompression bonding for thin electronic power chips

Direct thermocompression bonding for thin electronic power chips

US Patent 5184206 · Granted Feb 2, 1993

Estimated economic value: $17,776,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of uniformly dispersing nickel-plated conductive particles of single laye2022
Non-conductive film and non-conductive paste including zinc particles, semicondu2016
Fiber, fiber aggregate and adhesive having the same2013
CMOS image sensor module with wafers2008
Polymer/ceramic composite paste for embedded capacitor and method for fabricatin2008
High reliability non-conductive adhesives for non-solder flip chip bondings and 2005
High adhesion triple layered anisotropic conductive adhesive film2005
Method for manufacturing conductive adhesive for high frequency flip chip packag2003
Method for forming flip chip bump and UBM for high speed copper interconnect chi2002
Preparation method of anisotropic conductive adhesive for flip chip interconnect2001
Stacked semiconductor chip package having external terminal pads and stackable c2001
Method of making stackable semiconductor chips to build a stacked chip module2000