Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

US Patent 6238597 · Granted May 29, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with embedded optical die2024
Co-packaging with silicon photonics hybrid planar lightwave circuit2024
Co-packaging with silicon photonics hybrid planar lightwave circuit2022
Method of uniformly dispersing nickel-plated conductive particles of single laye2022
Semiconductor package with embedded optical die2021
Molding compound including a carbon nano-tube dispersion2021
Optoelectronic device module having a silicon interposer2020
Method of fabricating an optical module that includes an electronic package2019
In-package photonics integration and assembly architecture2019
Optoelectronic packaging assemblies2018
Forming a carbon nano-tube dispersion2018
Integrated circuit with chip-on-chip and chip-on-substrate configuration2018