Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder plate reflow method for forming a solder bump on a circuit trace intersection

Solder plate reflow method for forming a solder bump on a circuit trace intersection

US Patent 5160409 · Granted Nov 3, 1992

Estimated economic value: $5,937,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-current electrical pass through standoff connection for electronic box2025
Sensing decal2023
Electronics device having a plastic cover with a sealed center boss2023
Compliant pin structure for discrete electrical components2022
Headerless harness connection assembly and methods of constructing and utilizing2022
Force detecting sensor2022
Sensing decal2022
Electronics device having a plastic cover with a sealed center boss2021
Electronics device having a plastic cover with a sealed center boss2021
Systems and methods for recovering and controlling post-recovery motion of unman2020
Method and structure for limiting cover deflection in an ECU with leakage testin2020
Electronics module enclosure2019