Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic circuit packages with tear resistant organic cores

Electronic circuit packages with tear resistant organic cores

US Patent 5103293 · Granted Apr 7, 1992

Estimated economic value: $19,683,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Turbine for decompression of exhaust gas and a fuel cell system including same2018
Thermally enhanced electronic package2016
Downhole wet mate connection2014
Deformable dart and method2013
Thermally enhanced electronic package utilizing carbon nanocapsules and method o2012
Multi-chip stack package structure2012
Multi-chip stack package structure2012
Multi-chip stack package structure2012
Downhole piezoelectric devices2012
Fabricating process of a chip package structure2011
Semiconductor package structure and method for manufacturing the same2011
Chip package2011