Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

US Patent 7973310 · Granted Jul 5, 2011

Estimated economic value: $3,374,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pattern formation method and method for manufacturing a semiconductor device2023
Pattern formation method and method for manufacturing a semiconductor device2021
Multiple layer scheme patterning process2020
Spinal surgical instrument, method of guiding thereof and system for bone stabil2020
Multiple layer scheme patterning process2019
Thermally enhanced electronic package2016
Thermally enhanced electronic package2016
Magnetic separation unit, magnetic separation device and method for separating m2015
Downhole wet mate connection2014
Thermally enhanced electronic package2013
RFID real-time information system accommodated to semiconductor supply chain2013
RFID real-time information system accommodated to semiconductor supply chain2013