Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bond structures on MEMS element and ASIC element

Bond structures on MEMS element and ASIC element

US Patent 12448280 · Granted Oct 21, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micromechanical device2025
Micromechanical component for a capacitive pressure sensor device, capacitive pr2025
Micromechanical component for a capacitive pressure sensor device, capacitive pr2025
Semiconductor component including a dielectric layer2025
Method for producing a bonding pad for a micromechanical sensor element2025
Semiconductor component including a dielectric layer2025
Micromechanical component for a sensor or microphone device2025
Micromechanical component for a sensor or microphone device2025
Method for manufacturing a MEMS switch having an embedded metal contact2025
Quick-hitch for construction vehicle tools2024
Micromechanical component for a sensor device having a capacitor sealing structu2024
Method for manufacturing a piezoelectric resonator2024