Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packages with enlarged through-vias in encapsulant

Packages with enlarged through-vias in encapsulant

US Patent 12431400 · Granted Sep 30, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure, stacked structure with terminal comprising capping laye2025
Fabricating a sensing component encapsulated by an encapsulation layer with roug2025
Integrated circuit package and method2025
Semiconductor packages and method of manufacturing the same2025
Dense redistribution layers in semiconductor packages and methods of forming the2025
Dense redistribution layers in semiconductor packages and methods of forming the2025
Package structure including a die having a taper-shaped die connector2025
Package structure including a die having a taper-shaped die connector2025
Package structure including a die having a taper-shaped die connector2025
Semiconductor package2025
Semiconductor device2025
Semiconductor device structure and method for forming the same2025